Method for controlling tensile and compressive stresses and mech

Details Method for controlling tensile and compressive stresses and mech Method for controlling tensile and compressive stresses and mech

1995-05-01

1998-11-10

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438686, H01L 2144

Patent

active

058343741

ABSTRACT:
A method for forming thin films and controlling the tensile and compressive stresses and mechanical properties of the thin film. The method includes forming an alloy on a substrate having a solvent metal and a solute, then annealing the substrate and the alloy in one of an oxidizing, nitriding and carborizing ambient so that the ambient reacts with the solute to form respectively one of an oxide, nitride and carbide precipitates of the solute in the solvent. The solute is selected so that the precipitates formed may be used to control the mechanical properties of the solvent.

REFERENCES:
patent: 3026200 (1962-03-01), Gregory et al.
patent: 3399086 (1968-08-01), Das et al.
patent: 3779714 (1973-12-01), Nadkarni et al.
patent: 3922180 (1975-11-01), Fuchs et al.
patent: 4077830 (1978-03-01), Fulwiler
patent: 4315777 (1982-02-01), Nadkarni et al.
patent: 4322754 (1982-03-01), Mason
patent: 4383284 (1983-05-01), Isshiki
patent: 4772452 (1988-09-01), Brupbacher et al.
patent: 4887146 (1989-12-01), Hinode
patent: 4915908 (1990-04-01), Nagle et al.
patent: 5063120 (1991-11-01), Edmonson et al.
patent: 5190807 (1993-03-01), Kimock et al.
patent: 5253122 (1993-10-01), Chiba et al.
patent: 5279026 (1994-01-01), Uhde
patent: 5285109 (1994-02-01), Tomikawa et al.
patent: 5308794 (1994-05-01), Tu
patent: 5336547 (1994-08-01), Kawakita et al.
"Preparation of High-Strength Materials by Controlling the Dispersion of a Second Phase" by S.R. Mader et al.; IBM Technical Disclosure Bulletin; vol. 9, No. 12, May 1967; pp. 1788-1789.
"The Emerging Role of Flexible Media" by Patel and Richards; IEEE, vol. 81, No. 4, pp. 595-606 (abstract only).
"The Promise of CD-ROM is Now Being Realized" by Dayton; Office, Sep. 1989, vol. 110, pp. 50, 56 (abstract only).
"On Data Security of Magnetic Data Media", Output, pp. 33-37, Feb. 1986 (abstract only).

Affiliated with

Also associated with

Rating

Method for controlling tensile and compressive stresses and mech does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for controlling tensile and compressive stresses and mech, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for controlling tensile and compressive stresses and mech will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1516358