Method of manufacturing MOS transistor device with improved thre

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438306, H01L 218238, H01L 21336

Patent

active

058588272

ABSTRACT:
A method of manufacturing MOS semiconductor device, is disclosed, in which considerations are given to the influence of threshold value on ion implantation, and the dose of impurity to be ion implanted for forming high impurity concentration regions as source and drain regions is set to a value, at which the threshold value is substantially constant with impurity dose changes (the impurity dose being set to 10.sup.15 per cm.sup.2 or below for n-type impurity region). Thus, it is made possible to adequately set and control the threshold value, thus solving particularly the problem of reverse short channel effect and permitting formation of MOS parts with different threshold values.

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Stanley Wolf, Silicon Processing for the VLSI Era, vol. 3, 226-232, 1995.

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