Semiconductor wafer support with graded thermal mass

Heating – Accessory means for holding – shielding or supporting work... – Support structure for heat treating ceramics

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

432241, 432253, 432259, 392418, F27D 500

Patent

active

058488898

ABSTRACT:
An annular-shaped edge ring support for a semiconductor wafer has an innermost radial portion for supporting the semiconductor wafer and an outermost radial portion contiguous with the inner portion. The inner portion has a graded thermal mass that generally increases with increasing radius.

REFERENCES:
patent: 4770630 (1988-09-01), Akimoto et al.
patent: 5316472 (1994-05-01), Niino et al.
patent: 5431561 (1995-07-01), Yamabe et al.
patent: 5443382 (1995-08-01), Tsurumi et al.
patent: 5482559 (1996-01-01), Imai et al.
patent: 5556275 (1996-09-01), Sakata et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor wafer support with graded thermal mass does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer support with graded thermal mass, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer support with graded thermal mass will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1452672

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.