Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage
Patent
1992-12-01
1995-03-07
Evans, F. L.
Optics: measuring and testing
By configuration comparison
With comparison to master, desired shape, or reference voltage
356237, 348126, G01B 1100, G01N 2188
Patent
active
053963342
ABSTRACT:
A bonded wire inspection apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame including: a vertical illuminator that illuminates an object of inspection from above; an optical assembly that images particular portions of the object such as the ball at one end of a wire and the crescent at another end of the wire, by receiving the light that is emitted from the vertical illuminator and reflected by the object; a camera that photographs the image obtained by the optical assembly; and a diaphragm that is provided beneath the vertical illuminator and electrically changeable in its opening diameter. Thus, by adjusting the opening diameter of the diaphragm, clear images of the object are constantly obtained despite the differences of surface smoothness of the portions to be inspected.
REFERENCES:
patent: 3955208 (1976-05-01), Wick et al.
patent: 4423937 (1984-01-01), Suzuki et al.
patent: 5030008 (1991-07-01), Scott et al.
patent: 5059559 (1991-10-01), Takahashi et al.
Evans F. L.
Kabushiki Kaisha Shinkawa
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