Vertically integrated multi-chip circuit package with heat-sink

Details Vertically integrated multi-chip circuit package with heat-sink Vertically integrated multi-chip circuit package with heat-sink

1998-01-22

1999-07-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361695, 361704, 361749, 361752, 165 803, 165185, 174 163, 174 524, H05K 720

Patent

active

059263695

ABSTRACT:
A multi-chip carrier which uses less lateral mounting space on the surface of a circuit board or card can be formed using flexible circuitized material. Lateral space is compressed by utilizing more vertical space to package chips and components. The problem of cooling multiple chips in a tight space may be accomplished by integrating the heat sink in with the circuit carrier and having the heat sink double as a support structure. A flex material is folded or shaped. Different regions of the flex are used for mounting chips, mounting support mechanisms, or mounting the structure on a carrier or substrate.

REFERENCES:
patent: 5179501 (1993-01-01), Ocken et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5345205 (1994-09-01), Kornrumpf
patent: 5382829 (1995-01-01), Inoue
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5519578 (1996-05-01), Fujii
patent: 5544015 (1996-08-01), Akami

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