Metal fusion bonding
Process
Preplacing solid filler
Inventor
active
Desoldering apparatus and method
Free standing, three dimensional, multi-chip, carrier package wi
Free standing, three dimensional, multi-chip, carrier...
Integrated, multi-chip, thermally conductive packaging device an
Vertically integrated multi-chip circuit package with heat-sink
No associations
LandOfFree
John R. Slack does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with John R. Slack, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and John R. Slack will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-916486