Contact formation using two anneal steps

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438660, 438663, 438530, 438653, 438627, 438643, 438592, H01L 21336

Patent

active

061107891

ABSTRACT:
A method of forming a contact is provided. The method includes the steps of forming a contact hole, creating an enhanced doped region in the contact hole, annealing the enhanced doped region, depositing a barrier metal in the contact hole, annealing the barrier material, and depositing a conductive material in the contact hole. A contact made in this manner exhibits lower contact-to-substrate leakage currents than does a contact formed via conventional single-anneal techniques.

REFERENCES:
patent: 4891328 (1990-01-01), Gris
patent: 5232874 (1993-08-01), Rhodes et al.
patent: 5240874 (1993-08-01), Roberts
Wolf, Silicon Processing for the VLSI Era:vol. 1--Process Technology, Lattice Press, pp. 57, 303-307, 327, 398 & 399, 1986.
Wolf, Silicon Processing for the VLSI Era:vol. 2--Process Integration, Lattice Press, p. 132, 1986.
Fuse et al.; A Practical Trench Isolation Technology With A Novel Planarization Process; IEEE; pp. 732-735; 1987.
Hori et al.; A New Submicron MOSFET With LATID (Large-Tilt-Angle Implanted Drain) Structure; Japan; pp. 15-16; 1988.
Hori; 1/4-.mu.m LATID (Large-Tilt-Angle Implanted Drain) Technology for 3.3-V Operation; Japan; 1989.
Nagatomo et al.; A High Density 4M DRAM Process Using Folded Bitline Adaptive Side-Wall Isolated Capacitor (FASIC) Cell; IEEE; pp. 144-147; 1986.
Sunouchi et al; Process Integration For 64M DRAM Using An Asymmetrical Stacked Trench Capacitor (AST) Cell; IEEE; pp. 647-650; 1990.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Contact formation using two anneal steps does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Contact formation using two anneal steps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contact formation using two anneal steps will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1249206

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.