Plastic-molded-type semiconductor device

Details Plastic-molded-type semiconductor device Plastic-molded-type semiconductor device

1993-05-28

1994-09-13

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 257666, 257777, H05K 502

Patent

active

053474295

ABSTRACT:
A plastic-molded-type semiconductor device includes a plurality of semiconductor chips, metallic wires connected to the semiconductor chips, leads connected to the metallic wires, and an insulating member interposed between the semiconductor chips and sealed in a resin member. Circuit formed surfaces of the semiconductor chips are directed in the same direction, and one or more of the semiconductor chips serve as a base on which the other semiconductor chips are mounted through the insulating member. One ends of the leads are bonded to the insulating member, and electrodes pad of each semiconductor chip are not covered by the other semiconductor chips, the insulating member and the leads, and therefore are exposed to the surface of the insulating member. In this device, the provision of a tab is omitted, and the laminated chips can be contained in a package thinner than a conventional package. Since the circuit formation surfaces of all of the chips are directed in the same direction, all of the electrical connections can be made by wire bonding from one direction.

REFERENCES:
patent: 4722027 (1988-01-01), Hayakawa
patent: 5012323 (1991-04-01), Farnworth

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