4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Nae Yoneda

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Electronic component, electronic component assembly and electron

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Encapsulated semiconductor device package having holes for elect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Method of manufacturing a semiconductor device a ball grid...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of manufacturing a semiconductor device having a ball gri

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Plastic encapsulated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Profile ID: LFUS-PAI-P-570757

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