Method for fabricating interconnecting lines and contacts using

Details Method for fabricating interconnecting lines and contacts using Method for fabricating interconnecting lines and contacts using

1996-07-12

1997-08-19

Picardat, Kevin

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438633, 438638, 438639, 438672, H01L 2144

Patent

active

056588305

ABSTRACT:
The present invention is a method for fabricating interconnecting lines and contacts using conformal deposition. This invention applies patterning trenches simultaneously for interconnecting lines and contact holes and forming spacers technologies to make fully filled interconnecting line and contact holes. Then, utilizing the conformal deposition and blanket etch-back etching method, the present invention can fabricating interconnecting lines and contacts simultaneously.

REFERENCES:
patent: 4936950 (1990-06-01), Doan et al.
patent: 5200030 (1993-04-01), Cho et al.
patent: 5266446 (1993-11-01), Chang et al.
patent: 5316978 (1994-05-01), Boyd et al.
patent: 5460987 (1995-10-01), Wen et al.
patent: 5474651 (1995-12-01), Huebner
patent: 5484747 (1996-01-01), Chien
patent: 5498566 (1996-03-01), Lee
patent: 5536625 (1996-07-01), Bohr

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