Method to form hemi-spherical grain (HSG) silicon

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438398, 438593, 438665, 438684, 438964, H01L 218234

Patent

active

061210811

ABSTRACT:
An embodiment of the present invention develops a process for forming Hemi-Spherical Grained silicon by the steps of: forming amorphous silicon from a gas source comprising at least one of dichlorosilane, disilane or trisilane, wherein the amorphous silicon comprising at least one impurity doped amorphous portion, the amorphous silicon is deposited at a deposition temperature no greater than 525.degree. C.; and annealing the amorphous silicon for a sufficient amount of time and at an elevated annealing temperature, thereby transforming the amorphous silicon into the Hemi-Spherical Grained silicon.

REFERENCES:
patent: 5134086 (1992-07-01), Ahn
patent: 5162248 (1992-11-01), Dennison et al.
patent: 5170233 (1992-12-01), Liu et al.
patent: 5227322 (1993-07-01), Ko et al.
patent: 5278091 (1994-01-01), Fazan et al.
patent: 5318920 (1994-06-01), Hayashide
patent: 5340765 (1994-08-01), Dennison et al.
patent: 5342800 (1994-08-01), Jun
patent: 5350707 (1994-09-01), Ko et al.
patent: 5366917 (1994-11-01), Watanabe et al.
patent: 5385863 (1995-01-01), Tatsumi et al.
patent: 5407534 (1995-04-01), Thakur
patent: 5480826 (1996-01-01), Sugahara et al.
patent: 5629223 (1997-05-01), Thakur
patent: 5656531 (1997-08-01), Thakur et al.
Uemoto et al in "IEEE Symposium on VLSI Technology" 1990, pp. 2821-2822.
"A New Cylindrical Capacitor Using HSG Si for 256 Mb DRAMS" by Watanabe et al IEDM, 1992, pp. 259-262.
NEC Corp. Forming HSG polysilicon layer, J. Appl. 71(7), Apr. 1, 1992, pagers 3538-3543.
Jun et al. The Fabrication and Electrical Properties of Modulated Stacked Capacitor, pp. 430-432, 1992 IEEE, Electron Device letter, vol. 13, No. 8.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method to form hemi-spherical grain (HSG) silicon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to form hemi-spherical grain (HSG) silicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to form hemi-spherical grain (HSG) silicon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1072003

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.