Bond inspection technique for a semiconductor chip

Details Bond inspection technique for a semiconductor chip Bond inspection technique for a semiconductor chip

1992-06-01

1993-09-21

Cuchlinski, Jr., William A.

Thermal measuring and testing

Leak or flaw detection

With heating or cooling of specimen for test

374124, 374137, 228104, G01N 2518

Patent

active

052462919

ABSTRACT:
A bond inspection technique which determines the integrity of a plurality of package leads (13) bonded to a plurality of contact areas (12) on a semiconductor chip (11). A bonding process heats each package lead (13) bonded to each contact area (12). A camera (16) forms an infra-red intensity image at a predetermined time of the semiconductor chip (11) and ports image data to a computer (18). Infra-red intensity radiated from each bond on the semiconductor chip (11) is compared by the computer (18) with infra-red intensity data of known good and bad bonds. The comparison of each bond determines bond integrity of the semiconductor chip (11).

REFERENCES:
patent: 3803413 (1974-04-01), Vanzetti et al.
patent: 4792683 (1988-12-01), Chang et al.
patent: 4999499 (1991-03-01), Bhatt
patent: 5052816 (1991-10-01), Nakamura et al.
patent: 5064291 (1991-11-01), Reiser

Affiliated with

Also associated with

Rating

Bond inspection technique for a semiconductor chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bond inspection technique for a semiconductor chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bond inspection technique for a semiconductor chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1045455