4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Outside periphery of package having specified shape or...

Paul A. Ogden

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Bond inspection technique for a semiconductor chip

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Patent

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Integrated circuit package with removable shield

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent

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Profile ID: LFUS-PAI-P-392873

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