Method for producing high density multi-layer integrated circuit

Details Method for producing high density multi-layer integrated circuit Method for producing high density multi-layer integrated circuit

1995-10-11

1997-10-21

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430314, 430315, 430316, 430317, 430318, G03F 738, G03F 740

Patent

active

056794983

ABSTRACT:
A method of producing multi-layered chip carriers by coating the surface of a base layer with a photosensitive dielectric material which forms a dielectric layer; curing at least a portion of the dielectric layer by exposure to radiation; depositing a catalyst on the cured portion of the dielectric layer to form a sensitized dielectric layer; applying a photoresist layer upon the sensitized dielectric layer; curing at least a portion of the photoresist layer; developing the cured photoresist layer by removing uncured portions, thereby exposing corresponding portions of the underlying sensitized dielectric layer; forming conductors on the exposed dielectric layer; stripping the cured photoresist layer: coating a layer of photosensitive dielectric material upon the cured dielectric layer; and repeating the steps to produce successive layers which form a multi-layer chip carrier having a plurality of conductor layers separated by layers of insulating dielectric material.

REFERENCES:
patent: 4643935 (1987-02-01), McNeal et al.

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