Zirconium and/or hafnium oxynitride gate dielectric

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438761, 438763, 438765, 438769, 438775, 438785, 438786, 257213, 257288, 257310, 257410, 257411, H01L 21283, H01L 2131, H01L 21441, H01L 21469

Patent

active

060135530

ABSTRACT:
A field effect semiconductor device comprising a high permittivity zirconium (or hafnium) oxynitride gate dielectric and a method of forming the same are disclosed herein. The device comprises a silicon substrate 20 having a semiconducting channel region 24 formed therein. A zirconium oxynitride gate dielectric layer 36 is formed over this substrate, followed by a conductive gate 38. Zirconium oxynitride gate dielectric layer 36 has a dielectric constant is significantly higher than the dielectric constant of silicon dioxide.

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