Zincate catalysis electroless metal deposition for via metal int

Details Zincate catalysis electroless metal deposition for via metal int Zincate catalysis electroless metal deposition for via metal int

1999-01-19

2000-07-04

Nelms, David

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

H01L 2144

Patent

active

060838345

ABSTRACT:
A method of forming an interconnect or metal line in a semiconductor device using an zinc activated metal surface and electroless deposition. The invention forms an active metal layer (e.g., Al) layer on an insulating layer in a via hole, activates the active metal layer to form a Zn layer, and electrolessly deposits a metal (e.g., Cu, Ni, Au, or Ag) by reacting with the Zn layer. The metal layer is electroless deposited over the insulating layer. The metal layer fills the via hole to form a metal interconnect or line. Key features of the invention are the active metal layer and the zincate process (not a zinc particle process).

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patent: 5017516 (1991-05-01), van der Putten
patent: 5028454 (1991-07-01), Lytle et al.
patent: 5147692 (1992-09-01), Bengston
patent: 5182006 (1993-01-01), Haydu et al.
patent: 5308796 (1994-05-01), Feldman et al.
patent: 5466360 (1995-11-01), Ehrsam et al.

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