Write head fabrication by inverting order of process steps

Details Write head fabrication by inverting order of process steps Write head fabrication by inverting order of process steps

2006-10-31

2006-10-31

Norton, Nadine G. (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C029S603100, C029S603150, C029S603160, C216S022000, C216S057000, C360S313000, C360S324000, C438S692000, C438S697000, C438S700000

Reexamination Certificate

active

07129177

ABSTRACT:
During fabrication of a write head via holes are first opened in a gap layer, followed by formation of seed layers instead of the other way around. Moreover a first seed layer is formed, and without the first seed layer being used a second seed layer is formed. The second seed layer (which is the topmost layer) is used in plating to form coils (e.g. of copper) for the write head. After coil formation, the first seed layer is used for plating to form vias (e.g. of NiFe). The two seed layers may be formed in a single operation by using two different targets in a vacuum deposition chamber. Moreover, a single insulation layer is sufficient to insulate and protect all plated elements, regardless of whether they are formed by use of the first seed layer or the second seed layer.

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