Wiring substrate, solid-state imaging apparatus using the...

Details Wiring substrate, solid-state imaging apparatus using the... Wiring substrate, solid-state imaging apparatus using the...

2005-02-07

2010-02-09

Ho, Tuan (Department: 2622)

Television

Camera, system and detail

Optics

Reexamination Certificate

active

07659936

ABSTRACT:
In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

REFERENCES:
patent: 7005310 (2006-02-01), Hanada et al.
patent: 2003-188365 (2003-07-01), None
patent: 2003-259169 (2003-09-01), None
patent: 2004-031932 (2004-01-01), None
patent: 20-0308381 (2003-03-01), None
patent: 2003-0087528 (2003-11-01), None
English language abstract of Korean Publication No. 2003-0087528.
English language abstract of the Korean Publication No. 20-0308381.
English language abstract of the Japanese Publication No. 2003-259169.
English language abstract of the Japanese Publication No. 2003-188365.

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