Wiring substrate of a semiconductor component comprising...

Details Wiring substrate of a semiconductor component comprising... Wiring substrate of a semiconductor component comprising...

2007-02-20

2009-12-29

Smith, Bradley K (Department: 2894)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S774000, C257S778000, C257S737000, C257S623000, C257SE23037

Reexamination Certificate

active

07638418

ABSTRACT:
A wiring substrate of a semiconductor component includes: an underside with a wiring structure; a top side with cutouts; a rubber-elastic material arranged in the cutouts; and external contact pads arranged on the rubber-elastic material and configured to be coupled to external contacts. A method for producing a wiring substrate of this type, involves pressing the rubber-elastic material pads into a precursor of a polymer plastic during the production process.

REFERENCES:
patent: 5759047 (1998-06-01), Brodsky et al.
patent: 5900674 (1999-05-01), Wojnarowski et al.
patent: 6020220 (2000-02-01), Gilleo et al.
patent: 6265245 (2001-07-01), Farnworth et al.
patent: 6358836 (2002-03-01), Lu et al.
patent: 6399896 (2002-06-01), Downes, Jr. et al.
patent: 6417029 (2002-07-01), Fjelstad
patent: 2002/0025587 (2002-02-01), Wada
patent: 2002/0030288 (2002-03-01), Hashimoto
patent: 2002/0192865 (2002-12-01), Imasu et al.
patent: 2003/0121698 (2003-07-01), Kyougoku et al.
patent: 2003/0127747 (2003-07-01), Kajiwara et al.
patent: 2003/0168748 (2003-09-01), Katagiri et al.
patent: 2003/0201534 (2003-10-01), Eichelberger et al.
patent: 2004/0147060 (2004-07-01), Seo
patent: 10134011 (2003-01-01), None
Ray Fillion, Laura Meyer, Kevin Durocher, Slawomir Rubinsztajn, David Shaddock, “Stress Free Area Array Structures for Flip Chips and Chip Scale Devices,” 14th European Microelectronics and Packaging Conference & Exhibition Friedrichshafen, Germany, Jun. 23-25, 2003, GE Global Research Center, Niskayuna, NY.

Affiliated with

Also associated with

Rating

Wiring substrate of a semiconductor component comprising... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring substrate of a semiconductor component comprising..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring substrate of a semiconductor component comprising... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4130682