Wiring substrate having position information

Details Wiring substrate having position information Wiring substrate having position information

2005-02-15

2005-02-15

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S623000, C438S624000, C438S625000

Reexamination Certificate

active

06855626

ABSTRACT:
A method for producing a wiring board for a semiconductor package having a base substrate with first and second surfaces; a wiring layer including wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information formed for the respective semiconductor element mounting areas, the individual patterns having a different shape for each of the respective semiconductor element mounting areas. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.

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