Wiring board and method of producing the same

Details Wiring board and method of producing the same Wiring board and method of producing the same

2006-02-14

2006-02-14

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S772000

Reexamination Certificate

active

06998336

ABSTRACT:
A method of producing a wiring board includes a preliminary plating step of forming a solder resist layer such that the main layer of each metal pad of the board is exposed in each corresponding opening and covering the surface of the exposed main layer with a preliminary Sn plated layer. A solder paste application step involves applying a solder paste, containing solder powder comprised of the high temperature Sn solder and thicker than the preliminary Sn plated layer, on the preliminary Sn plated layer. A subsequent solder melting step involves forming the Sn solder covering layer by melting the solder paste layer together with the preliminary Sn plated layer by heating the solder paste layer to a temperature higher than the liquid phase line temperature of the high temperature Sn solder. This wettingly extends the melted layers over the surface of the main layer.

REFERENCES:
patent: 5953623 (1999-09-01), Boyko et al.
patent: 10-112514 (1998-04-01), None
Takao et al; “Development of Highly Reliable Sn-Ag Lead-Free Solder Alloy”; R&D, vol. 35, No. 2, Jun., 2000, Abstract.

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