Wiring board and method of manufacturing the same

Details Wiring board and method of manufacturing the same Wiring board and method of manufacturing the same

2011-02-08

2011-02-08

Gurley, Lynne A (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE23169, C257SE21502, C257SE23178, C438S108000, C029S830000, C029S846000, C029S847000, C029S835000, C029S832000, C174S262000, C174S255000

Reexamination Certificate

active

07884484

ABSTRACT:
A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.

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U.S. Appl. No. 11/373,610, Wiring Board Manufacturing Method, Yakaharu Yamano, filed Mar. 10, 2006.

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