Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-08-23
2011-08-23
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S642000, C438S648000, C257SE21577
Reexamination Certificate
active
08003519
ABSTRACT:
A BEOL manufacturing process for forming a via process between two metal lines on a semiconductor wafer comprises depositing a portion of a first metal adhesion layer within a patterned via hole, followed by a cooling step. The cooling step is then followed by formation of the remainder of the first metal adhesion layer and formation of a second metal adhesion layer within the patterned via hole. This process of forming the remaining portion of the first metal adhesion layer can be referred to as a wafer load, unload, load (LUL) process. By using a LUL process, thermal history is minimized, which reduces Al extrusion at the via interfaces.
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Chen Kuang-Chao
Huang Chi-Tung
Jiang Candy
Luoh Tuung
Baker & McKenzie LLP
Landau Matthew C
Macronix International Co. Ltd.
Snow Colleen E
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