Wirefilm bonding for electronic component interconnection

Details Wirefilm bonding for electronic component interconnection Wirefilm bonding for electronic component interconnection

1997-10-31

1999-12-28

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 45, 228 55, 228 62, 228106, B23K 3102, B23K 3700, B23K 100, B23K 3112

Patent

active

060069813

ABSTRACT:
A system (30) is provided for interconnecting a first component (10) having multiple first bonding sites (16) and a second component (12) having multiple second bonding sites (18). The system (30) includes a leadframe (40) coupled to the first component (10) and the second component (12) that advances from a first position (50) to a second position (52). A film tape carrier (32) advances a wirefilm (20) removably coupled to the film tape carrier (32) into the first position (50). The wirefilm (20) includes a substantially planar film (22) and multiple wire strands (14), each wire strand (14) having a first end (24) that contacts a first bonding site (16) and a second end (26) that contacts a second bonding site (18). A film attach tool (62) contacts the first component (10) and the second component (12) with the wirefilm (20) at the first position (50) to interconnect the first component (10) and the second component (12).

REFERENCES:
patent: 3724068 (1973-04-01), Galli
patent: 3926357 (1975-12-01), Matrisian
patent: 4184623 (1980-01-01), Strasser
patent: 4832225 (1989-05-01), Benjamin
patent: 4857671 (1989-08-01), Nakano et al.
patent: 5323947 (1994-06-01), Juskey et al.
patent: 5361490 (1994-11-01), Higgins, III et al.
patent: 5507910 (1996-04-01), Miyajima
patent: 5846366 (1998-12-01), Jin et al.

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