Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2006-08-08
2006-08-08
Coleman, W. David (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
Reexamination Certificate
active
07088009
ABSTRACT:
A system (10) is disclosed having a circuit portion (18,26,36) containing more than electrical conductors and a wirebonded assemblage (12,14,16) overlying the circuit portion (18,26,36). The wirebonded assemblage (12,14,16) comprises a plurality of wirebonded wires ((50,52),(60,64),(66,68)), each of the plurality of wirebonded wires being electrically coupled. The wirebonded assemblage (12,14,16) provides electrical shielding for the circuit portion (18,26,36). In one embodiment, the wirebonded assemblage provides for heat spreading.
REFERENCES:
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5406117 (1995-04-01), Dlugokecki et al.
patent: 6285573 (2001-09-01), Park
patent: 6521978 (2003-02-01), Fenk et al.
patent: 6534706 (2003-03-01), Rapp et al.
patent: 6538336 (2003-03-01), Secker et al.
patent: 6608390 (2003-08-01), Beatson et al.
patent: 6870255 (2005-03-01), Teig et al.
patent: 6956286 (2005-10-01), Kuzawinski et al.
patent: 2002/0080593 (2002-06-01), Tsuge et al.
patent: 2003/0029635 (2003-02-01), Anthony et al.
patent: 2004/0195591 (2004-10-01), Gehman et al.
Balconi-Lamica Michael J.
Coleman W. David
Freescale Semiconductor Inc.
Hill Susan C.
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