Wirebonded assemblage method and apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07088009

ABSTRACT:
A system (10) is disclosed having a circuit portion (18,26,36) containing more than electrical conductors and a wirebonded assemblage (12,14,16) overlying the circuit portion (18,26,36). The wirebonded assemblage (12,14,16) comprises a plurality of wirebonded wires ((50,52),(60,64),(66,68)), each of the plurality of wirebonded wires being electrically coupled. The wirebonded assemblage (12,14,16) provides electrical shielding for the circuit portion (18,26,36). In one embodiment, the wirebonded assemblage provides for heat spreading.

REFERENCES:
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5406117 (1995-04-01), Dlugokecki et al.
patent: 6285573 (2001-09-01), Park
patent: 6521978 (2003-02-01), Fenk et al.
patent: 6534706 (2003-03-01), Rapp et al.
patent: 6538336 (2003-03-01), Secker et al.
patent: 6608390 (2003-08-01), Beatson et al.
patent: 6870255 (2005-03-01), Teig et al.
patent: 6956286 (2005-10-01), Kuzawinski et al.
patent: 2002/0080593 (2002-06-01), Tsuge et al.
patent: 2003/0029635 (2003-02-01), Anthony et al.
patent: 2004/0195591 (2004-10-01), Gehman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wirebonded assemblage method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wirebonded assemblage method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wirebonded assemblage method and apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3675108

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.