Wirebond crack sensor for low-k die

Details Wirebond crack sensor for low-k die Wirebond crack sensor for low-k die

2007-07-31

2007-07-31

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

With measuring or testing

C438S614000, C257S781000, C257S784000

Reexamination Certificate

active

10906507

ABSTRACT:
A sensor for measuring cracks in a semiconductor device, such as a wafer and, more particularly, to a BEOL wirebond crack sensor for low-k dies or wafers, and a method of providing the wirebond crack sensor for low-k wafers or the like structures.

REFERENCES:
patent: 5751065 (1998-05-01), Chittipeddi et al.
patent: 5918107 (1999-06-01), Fogal et al.
patent: 5963046 (1999-10-01), Konuk
patent: 6117693 (2000-09-01), Fogal et al.
patent: 6366209 (2002-04-01), Dishongh et al.
patent: 6395568 (2002-05-01), Blish et al.
patent: 6503820 (2003-01-01), Shu
patent: 6548881 (2003-04-01), Blish et al.
patent: 6650010 (2003-11-01), Davis et al.
patent: 6682981 (2004-01-01), Leedy
patent: 6737745 (2004-05-01), Sabin et al.
patent: 6756908 (2004-06-01), Gass et al.
patent: 6759860 (2004-07-01), Hsiung et al.
patent: 2001/0043143 (2001-11-01), Dishongh et al.
patent: 2003/0197280 (2003-10-01), Davis et al.
patent: 2004/0099877 (2004-05-01), Towle et al.
patent: 2004/0119168 (2004-06-01), Downey et al.
patent: 2004/0129938 (2004-07-01), Landers et al.
patent: 0 895 073 (1998-07-01), None

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