Wire structure, method for fabricating wire, thin film...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE29139, C257SE29111, C257SE29151, C257SE29160, C257SE29159, C257SE29158, C257SE33063

Reexamination Certificate

active

07919795

ABSTRACT:
Provided are a wire structure, a method for fabricating a wire, a thin film transistor (TFT) substrate and a method for fabricating a TFT substrate. The wire structure includes a barrier layer formed on a substrate and including copper, copper solid solution layer.

REFERENCES:
patent: 6201590 (2001-03-01), Ohta et al.
patent: 6255706 (2001-07-01), Watanabe et al.
patent: 6803975 (2004-10-01), Kim et al.
patent: 7157323 (2007-01-01), Gan et al.
patent: 2007/0093003 (2007-04-01), Wu et al.
patent: 2008/0009108 (2008-01-01), Lin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wire structure, method for fabricating wire, thin film... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire structure, method for fabricating wire, thin film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire structure, method for fabricating wire, thin film... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2712045

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.