4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

David G. Love

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Apparatus for cooling semiconductor chips in multichip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Apparatus for forcing plating solution into via openings

Coating apparatus – With vacuum or fluid pressure chamber
Patent

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Captured-cell solder printing and reflow methods

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Captured-cell solder printing and reflow methods and apparatuses

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Patent

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Diffusion bonded interconnect

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Profile ID: LFUS-PAI-P-149876

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