Wire bonding with capillary realignment

Details Wire bonding with capillary realignment Wire bonding with capillary realignment

1997-12-18

2000-09-05

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228102, 228 45, B23K 3100, B23K 3102

Patent

active

061129720

ABSTRACT:
A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire bonding capillary having an indicator located thereon. A detector detects a signal from the indicator. The signal corresponds to a rotational alignment of the capillary and, therefore, to a direction of alignment of the capillary face. A first signal indicates a first alignment of the capillary face and a second signal indicates a second alignment of the capillary face. The signals may each have a relative signal strength which indicates rotational an offset of the capillary face from a given direction.

REFERENCES:
patent: 5180094 (1993-01-01), Yanagida et al.
patent: 5465899 (1995-11-01), Quick et al.
patent: 5544804 (1996-08-01), Test et al.
patent: 5565385 (1996-10-01), Rostoker et al.
patent: 5897048 (1999-04-01), Cheng et al.
patent: 5934543 (1999-08-01), Koduri
patent: 6006977 (1999-12-01), Koduri

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