Wire bonding method

Details Wire bonding method Wire bonding method

2006-11-14

2009-11-24

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S004500, C228S904000, C438S617000

Reexamination Certificate

active

07621436

ABSTRACT:
A wire bonding method including the steps of: descending a capillary5from above an external lead1to press a wire10to such an extent that the wire is not completely connected to the external lead1, thus forming a thin part16in the wire; next ascending the capillary5and the thin part16to substantially the same height as a first bonding point A, then moving the capillary5in a direction away from the first bonding point A, thus making a linear wire portion18and then cutting the wire at the thin part16; then connecting the end19(thin part) of the linear wire portion18and the wire tip end20at the lower end of the capillary5are connected to the external lead1; and then separating the wire tip end20from the external lead1.

REFERENCES:
patent: 6173885 (2001-01-01), Takahashi et al.
patent: 6270000 (2001-08-01), Nishiura
patent: 2003/0019098 (2003-01-01), Wildner
patent: 4-370942 (1992-12-01), None
patent: 9-51011 (1997-02-01), None
patent: 2000-82717 (2000-03-01), None

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