4. Material or article handling
  5. Device for emptying portable receptacle
  6. With jarring means

Tatsunari Mii

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Bump formation method and wire bonding method

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Capillary for a wire bonding apparatus

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent

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Capillary for use in a wire bonding apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Method for forming a ball in wire bonding

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Method for forming a ball in wire bonding

Electric heating – Metal heating – Wire – rod – or bar bonding
Patent

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Profile ID: LFUS-PAI-P-48427

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