4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Toshihiko Toyama

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Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Semiconductor device and wire bonding method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
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Wire bonding apparatus and method

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
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Wire bonding method

Metal fusion bonding – Process – Plural joints
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Wire bonding method

Metal fusion bonding – Process – Plural joints
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Profile ID: LFUS-PAI-P-2216605

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