Wire bonding method

Details Wire bonding method Wire bonding method

1998-03-17

2000-06-27

Graybill, David E.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438674, 438907, 2281805, 228904, H01L 21447, H01L 2160

Patent

active

060806516

ABSTRACT:
A wire bonding method in the manufacture of, for instance, a semiconductor device in which first bonding points or pads of a chip and second bonding points or leads of a lead frame are connected by wires, and the bonding by wires is initiated from one end of the row of the first bonding points (pads) and is successively performed in one direction toward a center of the row, and after bonding has been performed up to an approximate center of the row, then bonding is initiated from another end of the row in the opposite direction toward the center of the row.

REFERENCES:
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patent: 5465899 (1995-11-01), Quick et al.
patent: 5544804 (1996-08-01), Test et al.
patent: 5565378 (1996-10-01), Harada et al.
patent: 5586713 (1996-12-01), Arita et al.
patent: 5646451 (1997-07-01), Freyman et al.
patent: 5647527 (1997-07-01), Kenji
patent: 5665654 (1997-09-01), Stansbury

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