4. Image analysis
  5. Applications
  6. Manufacturing or product inspection

Takeyuki Nakagawa

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Bonding wire height detection method

Optics: measuring and testing – By polarized light examination – With light attenuation
Patent

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Clamping device for bonding machines

Work holders – Relatively movable jaws – With tool couple element
Patent

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Frame retainer mount used in bonding machines

Metal fusion bonding – With means to handle work or product
Patent

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Tray conveying apparatus and method

Material or article handling – Device for emptying portable receptacle – Nongravity type
Reexamination Certificate

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Wire bend inspection method and apparatus

Image analysis – Applications – Manufacturing or product inspection
Patent

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Profile ID: LFUS-PAI-P-192028

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