Wet-etch process and composition

Details Wet-etch process and composition Wet-etch process and composition

1990-10-30

1993-02-02

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

B05D 500

Patent

active

051835347

ABSTRACT:
A wet-etch composition for polyamic acids and partially cured polyamic acids containing an aqueous solution having a major portion of water, a substituted hydrocarbon solvent and a non-ionic base that is strong enough to deprotonate the polyamic acid or a partially cured polyamic acid in a weight ratio of 0.1-49:49-0.1, with the proviso that the composition contains less than 1.0 percent ionic base. The present invention further provides a process for wet-etching polyamic acids or partially cured polyamic acids.

REFERENCES:
patent: 3361589 (1968-01-01), Lindsey
patent: 3791848 (1974-02-01), DeAngelo
patent: 4276186 (1981-06-01), Bakos et al.
patent: 4411735 (1983-10-01), Belani
patent: 4436583 (1984-03-01), Saiki et al.
patent: 4592787 (1986-06-01), Johnson
patent: 4740562 (1988-04-01), Menke et al.
patent: 4857143 (1989-08-01), Glenning et al.
Ruiz "Fluorinated Polyimide Low Dielectric Coatings", pp. 209-218, 1989.
Davis "Wet Etch Patterning of Polyimide Siloxane for Electronic Applications" pp. 381-388 (1987).
Diener "Etching of Partially Cured Polyimide" pp. 353-364 (1984).
Saiki "Fine Pattern Processes for Polyimide Insulation" pp. 827-839 (1984).

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