Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
Inventor
active
Low dielectric constant, low moisture uptake polyimides and copo
Low dielectric constant, low moisture uptake polyimides and copo
Photoimageable compositions and films for printed wiring...
Polyamide from 3,5-diamino-t-butylbenzene
Polyamide from diamino-t-butylbenzene
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