Wedgebond pads having a nonplanar surface structure

Details Wedgebond pads having a nonplanar surface structure Wedgebond pads having a nonplanar surface structure

2006-01-03

2006-01-03

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S758000

Reexamination Certificate

active

06982493

ABSTRACT:
Disclosed is a wedgebond pad structure which includes a semiconductor substrate and a wedgebond pad. The wedgebond pad has a surface which includes a curved or v-shaped feature for receiving a wedge bond. The curved or v-shaped feature may be raised or recessed with respect to the wedgebond pad surface.

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