Water-level package with bump ring

Details Water-level package with bump ring Water-level package with bump ring

2005-01-04

2005-01-04

Wilson, Allan R. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S698000

Reexamination Certificate

active

06838762

ABSTRACT:
A wafer-level package includes a first chip, a second chip and a bump ring. The first chip has a semiconductor micro device, a bonding pad ring surrounding the semiconductor micro device, and a plurality of bonding pads disposed outside the bonding pad ring and electrically connected to the semiconductor micro device for electrically connecting to an external circuit. The second chip has a bonding pad ring corresponding to the bonding pad ring of the first chip. The bump ring is disposed between the bonding pad ring of the first chip and the bonding pad ring of the second chip for bonding the first and the second chips so as to form a hermetical cavity.

REFERENCES:
patent: 3591839 (1971-07-01), Evans
patent: 4802952 (1989-02-01), Kobori et al.
patent: 4839717 (1989-06-01), Phy et al.
patent: 5136363 (1992-08-01), Endo et al.
patent: 5323051 (1994-06-01), Adams et al.
patent: 5760470 (1998-06-01), Stansbury
patent: 5925936 (1999-07-01), Yamaji
patent: 6004867 (1999-12-01), Kim et al.
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 20030183407 (2003-10-01), Ma et al.
U.S. Appl. No. 09/928,694.

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