4. Semiconductor device manufacturing: process
  5. Making device or circuit responsive to nonelectrical signal
  6. Responsive to electromagnetic radiation

Kuo Chung Yee

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Multichip wafer-level package and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Optical integrated circuit element package and process for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Semiconductor package and method for manufacturing the same

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Semiconductor package structure and method for manufacturing...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Semiconductor package structure and method for manufacturing...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2399615

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