Wafer transfer station for a chemical mechanical polisher

Details Wafer transfer station for a chemical mechanical polisher Wafer transfer station for a chemical mechanical polisher

1999-10-06

2000-12-05

Beck, Shrive

Coating apparatus

Gas or vapor deposition

Multizone chamber

118500, 414935, 156345, B65G 4907, C23F 100

Patent

active

06156124&

ABSTRACT:
A transfer station and concomitant method for a chemical mechanical polishing system comprising a pair of buffer stations and a transport robot. The buffer stations and the ability to transport two wafers simultaneously with the transfer robot minimizes the exchange time for loading and unloading wafers into the chemical mechanical polishing system. The lowering of the exchange time improves the number of wafers processed per hour by the chemical mechanical polishing system. The transfer robot utilizes wafer edge grip features, adjustable wafer gripper force, minimum wafer contact points, fluid media for wafer present sensing, and mechanical interlocking mechanisms to protect both the wafer and the transfer station.

REFERENCES:
patent: 3968885 (1976-07-01), Hassan et al.
patent: 5180276 (1993-01-01), Hendrickson
patent: 5447409 (1995-09-01), Grunes et al.
patent: 5565034 (1996-10-01), Nanbu et al.
patent: 5569014 (1996-10-01), Hofmeister
patent: 5738574 (1998-04-01), Tolles
patent: 5934984 (1999-08-01), Togawa et al.
patent: 5944940 (1999-08-01), Toshima

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