Wafer surface cleaning apparatus and method

Details Wafer surface cleaning apparatus and method Wafer surface cleaning apparatus and method

1997-12-29

1999-02-02

Warden, Jill

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 6, 134 7, 134 18, 134 32, 134 42, 134 57R, 134902, 451 6, 451 38, 451 39, 451 75, 451 78, C03C 1900

Patent

active

058659013

ABSTRACT:
A substrate cleaning assembly (10) and method for removing contaminant substances (11) from a surface (12) of a substrate (13) employed in microelectronics manufacturing. The cleaning assembly (10) includes a substance locator (15) adapted to locate and map at least one contaminant substance (11) on the surface (12) of the substrate (13) and a dispenser (16) formed and dimensioned to accurately dispense a substantially controlled, impinging stream (17) of cleaning agent along a path (18). A controller (20) is coupled to the map device (15) and the dispenser (16), and is adapted to control the impinging stream (17) such that the located contaminant substance (11) is positioned in the path (18) of the impinging stream (17) to enable substantially localized impingement and removal of the substance (11) from the substrate surface (12).

REFERENCES:
patent: 3691695 (1972-09-01), Green et al.
patent: 3702042 (1972-11-01), Cochran et al.
patent: 5032217 (1991-07-01), Tanaka
patent: 5364472 (1994-11-01), Heyns et al.
patent: 5433650 (1995-07-01), Winebarger
patent: 5663797 (1997-09-01), Sandhu
patent: 5703642 (1998-03-01), Sandhu et al.

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