Wafer scale testing using a 2 signal JTAG interface

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing

Reexamination Certificate

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C714S715000, C714S733000

Reexamination Certificate

active

07904774

ABSTRACT:
Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuity, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

REFERENCES:
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patent: 6242269 (2001-06-01), Whetsel
patent: 6543020 (2003-04-01), Rajski et al.
patent: 6988232 (2006-01-01), Ricchetti et al.
patent: 7421633 (2008-09-01), Whetsel
Bhatia, S.; , “Test compaction by using linear-matrix driven scan chains,” Defect and Fault Tolerance in VLSI Systems, 2003. Proceedings. 18th IEEE International Symposium on , vol., no., pp. 185-190, Nov. 3-5, 2003 doi: 10.1109/DFTVS.2003.1250111.
Zacharia, N.; Rajski, J.; Tyszer, J.; Waicukauski, J.A.; , “Two-dimensional test data decompressor for multiple scan designs ,” Test Conference, 1996. Proceedings., International , vol., no., pp. 186-194, Oct. 20-25, 1996 doi: 10.1109/TEST.1996.556961.

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