Wafer level package using stud bump coated with solder

Details Wafer level package using stud bump coated with solder Wafer level package using stud bump coated with solder

2009-05-29

2011-12-06

Fourson, III, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S617000, C257SE21506, C257SE21509

Reexamination Certificate

active

08071470

ABSTRACT:
A method of fabricated a wafer level package is described. In one embodiment, the method includes fabricating at least one active device on a semiconductor wafer that has not been singulated, with the active device having a plurality of bonding pads exposed at an upper surface of the wafer. Prior to singulating the semiconductor wafer, a plurality of corresponding stud bumps on the plurality of bonding pads with a wire bonding tool are formed. Thereafter, a molding encapsulation layer is applied over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed.

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