4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Carsem (M) SDN. BHD.

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Multiple row exposed leads for MLP high density packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Wafer level package using stud bump coated with solder

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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