Wafer level capped sensor

Details Wafer level capped sensor Wafer level capped sensor

2007-10-02

2007-10-02

Larkin, Daniel S. (Department: 2856)

Measuring and testing

Surface and cutting edge testing

C073S488000, C257S678000, C257S704000, C257S773000

Reexamination Certificate

active

11088270

ABSTRACT:
A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.

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