Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer
Utility Patent
1997-11-28
2001-01-02
Hughes, S. Thomas (Department: 3726)
Special receptacle or package
Holder for a removable electrical component
For a semiconductor wafer
C206S707000, C211S041180
Utility Patent
active
06168025
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a wafer holding structure which is installed on the cover of semiconductor wafer container and is employed to push down and hold the wafers accommodated within the semiconductor wafer container.
2. Description of Related Art
There are many kinds of package containers employed to accommodate and convey semiconductor wafers. However, most of them consist of a carrier into which semiconductor wafers to be accommodated are inserted, a casing for accommodating the carrier therewithin, a cover engaging with the casing to seal the space enclosed by the casing, and a holding member for holding semiconductor wafers accommodated within the casing.
The conventional holding member is designed to be installed on the cover and to push down and hold the semiconductor wafers being inserted into the carrier one by one. Therefore, it must have a structure wherein semiconductor wafers accommodated in a partitioned manner do not disengage from the holding member even if subject to vibration or jarring during transportation.
The holding blades used to hold the semiconductor wafers are classified into two categories. One is that the neighboring holding blades are connected to each other, the other one is that each blade is separately formed. To compare the movements between the two categories of holding blades in response to any vibration of jarring that occurs during transportation, it is found that the connected holding blades have enhanced rigidity due to their connected structure and have strong resistance to being jarred by the semiconductor wafers. However, the neighboring holding blades are affected if one specified location incurs jarring. On the contrary, separately formed holding blades are not affected by the neighboring holding blades. Nevertheless, it is difficult to enhance the rigidity of each separately formed holding blade.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a semiconductor wafer holding structure in a container, which is capable of holding semiconductor wafers accommodated within a container and preventing semiconductor wafers from disengagement with the holding blade even if subject to vibration or jarring during transportation.
The semiconductor wafer holding structure according to this invention is disposed within a semiconductor wafer container within which accommodated semiconductor wafers are pushed down and held by the semiconductor wafer holding members. In the structure according to this invention, holding blades for contact with semiconductor wafers are formed at the top end of a wafer holding member, the holding blades are pushed down by the elastic force of the wafer holding member made of an elastic plate. Each holding blade is formed to separate from the neighboring ones, the body of the elastic plate is separated from the bodies of the neighboring ones, and the bases of the elastic plates are integrally formed and connected together.
Furthermore, the thickness of the elastic plate gradually decreases toward its top end.
Furthermore, the surface of the elastic plate is shaped in a curved manner.
Furthermore, the bending stress in the elastic plate, in response to the load coming from semiconductor wafers, is dispersed along the longitudinal axis thereof, and the location where stress distribution converges is set not to be at a boundary between the elastic plate and the frame portion to which the elastic plate is affixed.
Furthermore, the stress in the elastic plate is increased sharply before the displacement of the holding blade induced by the semiconductor wafer exceeds the depth of the holding blade.
Furthermore, there is a terrace portion formed at the base of the elastic plate.
Furthermore, the cross section of the elastic plate is set to be substantially a rectangular shape with larger width in the horizontal direction.
Furthermore, the elastic plate is installed on the cover by inserting its frame portion into an install slot formed in the cover, the thickness of the frame portion is set to be smaller than the width of the install slot and a plurality of protrusions are formed on the side walls of the frame portion.
Furthermore, the elastic plate is installed on the cover by way of the frame portion, frame engaging claws used to engage with the install claws of the cover are formed on the frame portion, and the frame engaging claws are formed on the frame portion surfaces without the holding blades.
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Ichino Ryousei
Miyahara Ryou
Nakai Akira
Sakurai Youichi
Hughes S. Thomas
Komatsu Electronic Metals Co. Ltd.
Nguyen Trinh
Sughrue Mion Zinn Macpeak & Seas, PLLC
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