4. Flexible bags
  5. Bag having means to facilitate opening it by severing bag...
  6. Including a separate tearing element which is gripped and...

Youichi Sakurai

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Unsealing structure with cut out for shrink film sealed packages

Flexible bags – Bag having means to facilitate opening it by severing bag... – Including a separate tearing element which is gripped and...
Patent

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Wafer holding structure for semiconductor wafer containers

Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer
Utility Patent

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Profile ID: LFUS-PAI-P-1123174

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