Wafer electroless plating system and associated methods

Details Wafer electroless plating system and associated methods Wafer electroless plating system and associated methods

2007-04-16

2011-12-06

Maldonado, Julio J (Department: 2823)

Coating apparatus

Immersion or work-confined pool type

With means for moving work through, into or out of pool

C118S058000, C118S066000, C118S429000, C118S500000, C438S678000, C438S687000

Reexamination Certificate

active

08069813

ABSTRACT:
A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).

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