4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Tiruchirapalli Arunagiri

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Thermal methods for cleaning post-CMP wafers

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Wafer electroless plating system and associated methods

Coating apparatus – Immersion or work-confined pool type – With means for moving work through – into or out of pool
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2205686

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