Wafer edge cleaning

Brushing – scrubbing – and general cleaning – Machines – Brushing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C015S088200, C015S088300, C015S102000, C414S936000, C134S006000

Reexamination Certificate

active

07900311

ABSTRACT:
In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided.

REFERENCES:
patent: 5861066 (1999-01-01), Moinpour et al.
patent: 5901399 (1999-05-01), Moinpour et al.
patent: 6059889 (2000-05-01), Jensen et al.
patent: 6092253 (2000-07-01), Moinpour et al.
patent: 6222339 (2001-04-01), Yamasaki et al.
patent: 6230753 (2001-05-01), Jones et al.
patent: 6272712 (2001-08-01), Gockel et al.
patent: 6382901 (2002-05-01), Hong et al.
patent: 6550091 (2003-04-01), Radman et al.
patent: 6594847 (2003-07-01), Krusell et al.
patent: 6837777 (2005-01-01), Ziemins et al.
patent: 6910240 (2005-06-01), Boyd et al.
patent: 2002/0005212 (2002-01-01), Beardsley et al.
patent: 2004/0049870 (2004-03-01), Tolles et al.
patent: 2005/0172430 (2005-08-01), Yudovsky et al.
patent: 2006/0096048 (2006-05-01), Mikhaylichenko et al.
patent: 2009/0044831 (2009-02-01), Yudovsky et al.
U.S. Appl. No. 12/245,745, filed Oct. 4, 2008.
Office Action of U.S. Appl. No. 10/976,011 mailed Jul. 9, 2008.
Oct. 9, 2008 Response to Office Action of U.S. Appl. No. 10/976,011 mailed Jul. 9, 2008.
Final Office Action of U.S. Appl. No. 10/976,011 mailed Jan. 28, 2009.
Notice of Abandonment of U.S. Appl. No. 10/976,011 mailed Aug. 12, 2009.
Office Action of U.S. Appl. No. 12/245,745 mailed Jul. 16, 2009.
Oct. 16, 2009 Response to Office Action of U.S. Appl. No. 12/245,745 mailed Jul. 16, 2009.
Final Office Action of U.S. Appl. No. 12/245,745 mailed Feb. 3, 2010.
Restriction Requirement of U.S. Appl. No. 10/976,011 mailed Mar. 5, 2008.
Apr. 7, 2008 Response to Restriction Requirement of U.S. Appl. No. 10/976,011 mailed Mar. 5, 2008.
Restriction Requirement of U.S. Appl. No. 12/245,745 mailed Mar. 23, 2009.
May 26, 2009 Response to Restriction Requirement of U.S. Appl. No. 12/245,745 mailed Mar. 23, 2009.
Notice of Abandonment of U.S. Appl. No. 12/245,745 mailed Jan. 4, 2011.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer edge cleaning does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer edge cleaning, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer edge cleaning will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2750783

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.